A Three-Axis Micromachined Accelerometer With A CMOS Position-Sense Interface And Digital Offset-Tri - Solid-State Circuits, IEEE Journal of
نویسندگان
چکیده
This paper describes a three-axis accelerometer implemented in a surface-micromachining technology with integrated CMOS. The accelerometer measures changes in a capacitive half-bridge to detect deflections of a proof mass, which result from acceleration input. The half-bridge is connected to a fully differential position-sense interface, the output of which is used for one-bit force feedback. By enclosing the proof mass in a one-bit feedback loop, simultaneous force balancing and analog-to-digital conversion are achieved. On-chip digital offset-trim electronics enable compensation of random offset in the electronic interface. Analytical performance calculations are shown to accurately model device behavior. The fabricated singlechip accelerometer measures 4 4 mm2, draws 27 mA from a 5-V supply, and has a dynamic range of 84, 81, and 70 dB along the x-, y-, and z-axes, respectively.
منابع مشابه
IEEE International Solid - State Circuits Conference ISSCC 2013 / SESSION 7 / OPTICAL TRANSCEIVERS AND SILICON PHOTONICS / 7 . 4 7 . 4 A Blind Baud - Rate ADC - Based CDR
ADC-based receivers process the received data in the digital domain, eliminating the need for much of the analog front end. In addition, a feed-forward blind architecture [1,2] eliminates the feedback loop between digital and analog domains so that the ADC and digital CDR can be designed and simulated independently. Previous works [1,2] sampled the incoming data at 2 samples per UI and at 1.45 ...
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